Multilayer Ceramic Chip Capacitors

C3216X7R1H155K160AB

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TDK item description ?	C3216X7R1H155KT****
Applications	Commercial Grade Please refer to Part No. CGA5L3X7R1H155K160AB for Automotive use.
Feature	GeneralGeneral (Up to 75V)
Series	C3216 [EIA 1206]
Status	Production (Not Recommended for New Design)

Images are for reference only and show example products.

Size

Length(L)	3.20mm ±0.20mm
Width(W)	1.60mm ±0.20mm
Thickness(T)	1.60mm ±0.20mm
Terminal Width(B)	0.20mm Min.
Terminal Spacing(G)	1.00mm Min.
Recommended Land Pattern (PA)	2.10mm to 2.50mm(Flow Soldering) 2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PB)	1.10mm to 1.30mm(Flow Soldering) 1.00mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PC)	1.00mm to 1.30mm(Flow Soldering) 1.10mm to 1.60mm(Reflow Soldering)

Electrical Characteristics

Capacitance	1.5μF ±10%
Rated Voltage	50VDC
Temperature Characteristic ?	X7R(±15%)
Dissipation Factor (Max.)	5%
Insulation Resistance (Min.)	333MΩ

Other

Soldering Method	Wave (Flow) Reflow
AEC-Q200	No
Packing	Blister (Plastic)Taping [180mm Reel]
Package Quantity	2000pcs