Multilayer Ceramic Chip Capacitors

FAQ

C3216X7T2J223K115AC

Product Status
Production (NRND)
Recommended Alternate Part No. : C3216X7R2J223K130AA (Interchangeability is not guaranteed.)
TDK Item Description Please refer to the FAQ about part number
C3216X7T2J223KT****
Applications
Commercial Grade
Please refer to Part No. CGA5H1X7T2J223K115AC for Automotive use.
Feature
MidMid Voltage (100 to 630V)
Series
C3216 [EIA 1206]
Status
Production (Not Recommended for New Design)Production (Not Recommended for New Design)
Recommended Alternate Part No. : C3216X7R2J223K130AA (Interchangeability is not guaranteed.)
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
3.20mm ±0.20mm
Width(W)
1.60mm ±0.20mm
Thickness(T)
1.15mm ±0.15mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
1.00mm Min.
Recommended Land Pattern (PA)
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PC)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)

Electrical Characteristics

Capacitance
22nF ±10%
Rated Voltage
630VDC
Temperature Characteristic
X7T(+22,-33%)
Dissipation Factor (Max.)
2.5%
Insulation Resistance (Min.)
10000MΩ

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
FIT (Failure In Time)
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Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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