Multilayer Ceramic Chip Capacitors
CGA2B2C0G1H010C050BD
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Size
| Length(L) |
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| Width(W) |
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| Thickness(T) |
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| Terminal Width(B) |
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| Terminal Spacing(G) |
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| Recommended Land Pattern (PA) |
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| Recommended Land Pattern (PB) |
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| Recommended Land Pattern (PC) |
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Electrical Characteristics
| Capacitance |
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| Rated Voltage |
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Temperature Characteristic
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| Q (Min.) |
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| Insulation Resistance (Min.) |
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Other
| Operating Temp. Range |
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| Soldering Method |
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| AEC-Q200 |
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| Packing |
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| Package Quantity |
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Tech Info
Documents
Technical Support Tools
3rd Party ECAD models
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SnapMagic
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
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Soft termination
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SMD / SMT Inductors (Coils)
MHQ1005P18NGT000
L=18nH
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L x W x T :
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SMD / SMT Inductors (Coils)
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Q=23
L x W x T :
1 x 0.6 x 0.5mm
Chip Beads
MMZ1608B601CTAH0
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.6mm
