Multilayer Ceramic Chip Capacitors

FAQ

CGA3E2C0G1H272J080AE

TDK item description  ?
CGA3E2C0G1H272JT***S
Applications
Automotive GradeAutomotive Grade
Feature
AEC-Q200AEC-Q200
SoftSoft Termination
Series
CGA3(1608) [EIA 0603]
Status
ProductionProduction
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C1608
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
1.60mm +0.20,-0.10mm
Width(W)
0.80mm +0.15,-0.10mm
Thickness(T)
0.80mm +0.15,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
2.7nF ±5%
Rated Voltage
50VDC
Temperature Characteristic  ?
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Allowable Voltage
Allowable Current

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
YES
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
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3rd Party ECAD models

  • SnapMagic
    SnapMagic

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Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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