Multilayer Ceramic Chip Capacitors
CGA3E3X8R1C474K080AD
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Size
| Length(L) |
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| Width(W) |
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| Thickness(T) |
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| Terminal Width(B) |
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| Terminal Spacing(G) |
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| Recommended Land Pattern (PA) |
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| Recommended Land Pattern (PB) |
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| Recommended Land Pattern (PC) |
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Electrical Characteristics
| Capacitance |
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| Rated Voltage |
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Temperature Characteristic
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| Dissipation Factor (Max.) |
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| Insulation Resistance (Min.) |
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Other
| Operating Temp. Range |
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| Soldering Method |
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| AEC-Q200 |
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| Packing |
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| Package Quantity |
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Tech Info
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CGA3E3X8R1C474K080AB
Capacitance=0.47μF
Edc=16V
T.C.=X8R
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High Temp. (Up to 150ºC)
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Multilayer Ceramic Chip Capacitors
CGA3E3X8R1C474K080AE
Capacitance=0.47μF
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T.C.=X8R
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Edc=16V
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LxWxT:1.6x0.8x0.8mm
Soft termination
AEC-Q200
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CGA4J1X8L1H474K125AC
Capacitance=0.47μF
Edc=50V
T.C.=X8L
LxWxT:2x1.25x1.25mm
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AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA4J3X7R1H225K125AE
Capacitance=2.2μF
Edc=50V
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LxWxT:2x1.25x1.25mm
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MLCC with Dipped Radial Lead
FG28C0G2A331JNT00
Capacitance=330pF
Edc=100V
T.C.=C0G
LxWxT:4x5.5x2.5mm, Lead pitch:5mm
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MLCC with Dipped Radial Lead
FK28C0G2A331JN000
Capacitance=330pF
Edc=100V
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LxWxT:4x5.5x2.5mm, Lead pitch:5mm
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B25615A6197J301
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Chip NTC Thermistors (Sensor)
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