Multilayer Ceramic Chip Capacitors

CGA4J3X8R1H154K125AB

Product Status	Production
TDK Item Description Please refer to the FAQ about part number	CGA4J3X8R1H154KT****
Applications	Automotive Grade
Feature	AEC-Q200AEC-Q200 150°CHigh Temperature Application
Series	CGA4(2012) [EIA 0805]
Brand	TDK
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MLCC,Multilayer Ceramic Chip Capacitors:C2012

Images are for reference only and show example products.

Size

Length(L)	2.00mm ±0.20mm
Width(W)	1.25mm ±0.20mm
Thickness(T)	1.25mm ±0.20mm
Terminal Width(B)	0.20mm Min.
Terminal Spacing(G)	0.50mm Min.
Recommended Land Pattern (PA)	1.00mm to 1.30mm(Flow Soldering) 0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)	1.00mm to 1.20mm(Flow Soldering) 0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)	0.80mm to 1.10mm(Flow Soldering) 0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance	150nF ±10%
Rated Voltage	50VDC
Temperature Characteristic	X8R(±15%)
Dissipation Factor (Max.)	3%
Insulation Resistance (Min.)	3333MΩ

Other

Operating Temp. Range	-55 to 150°C
Soldering Method	Wave (Flow) Reflow
AEC-Q200	YES
Packing	Embossed (Plastic)Taping [180mm Reel]
Package Quantity	2000pcs
FIT (Failure In Time)	This will be displayed when you login to myTDK

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Tech Info

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