Multilayer Ceramic Chip Capacitors
CGA6P3X7R1C156M250AB
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Documents
Technical Support Tools
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
CAA572X7R1H476M670LJ
Capacitance=47μF
Edc=50V
T.C.=X7R
LxWxT:6.25x5.0x6.7mm
MEGACAP type
Multilayer Ceramic Chip Capacitors
CGA1A2X7R1C471M030BA
Capacitance=470pF
Edc=16V
T.C.=X7R
LxWxT:0.6x0.3x0.3mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA5L1X7S1A156M160AC
Capacitance=15μF
Edc=10V
T.C.=X7S
LxWxT:3.2x1.6x1.6mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6L2X7R1H105M160AE
Capacitance=1μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x1.6mm
Soft termination
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6M1C0G3A102J200AE
Capacitance=1nF
Edc=1000V
T.C.=C0G
LxWxT:3.2x2.5x2mm
Soft termination
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P2C0G1H104J250AA
Capacitance=0.1μF
Edc=50V
T.C.=C0G
LxWxT:3.2x2.5x2.5mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P2X8R1E335K250AA
Capacitance=3.3μF
Edc=25V
T.C.=X8R
LxWxT:3.2x2.5x2.5mm
High Temp. (Up to 150ºC)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P3X7R1E685M250AB
Capacitance=6.8μF
Edc=25V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P3X7R1H475K250AD
Capacitance=4.7μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
Conductive Epoxy
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P3X7R1H475M250AB
Capacitance=4.7μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
General
AEC-Q200