Multilayer Ceramic Chip Capacitors
CGA6P3X7R1H475K250AB
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Documents
Technical Support Tools
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C2012X7R2E103M125AE
Capacitance=10nF
Edc=250V
T.C.=X7R
LxWxT:2x1.25x1.25mm
Soft termination
Multilayer Ceramic Chip Capacitors
C3225X7R1H475K250AB
Capacitance=4.7μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
General
Multilayer Ceramic Chip Capacitors
C3225X8R2A474K200AE
Capacitance=0.47μF
Edc=100V
T.C.=X8R
LxWxT:3.2x2.5x2mm
Soft termination
Multilayer Ceramic Chip Capacitors
CGA4J3X7R1C155K125AB
Capacitance=1.5μF
Edc=16V
T.C.=X7R
LxWxT:2x1.25x1.25mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6L2X7R1H105K160AA
Capacitance=1μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x1.6mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6M1C0G3B392J200AC
Capacitance=3.9nF
Edc=1250V
T.C.=C0G
LxWxT:3.2x2.5x2mm
High Volt. (1000V and over)
Multilayer Ceramic Chip Capacitors
CGA6M3X7R1H225K200AB
Capacitance=2.2μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x2mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6M3X7R2E104K200AA
Capacitance=0.1μF
Edc=250V
T.C.=X7R
LxWxT:3.2x2.5x2mm
Mid Volt. (100 to 630V)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6M3X7R2E224K200AA
Capacitance=0.22μF
Edc=250V
T.C.=X7R
LxWxT:3.2x2.5x2mm
Mid Volt. (100 to 630V)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6N3X7S1H475K230AB
Capacitance=4.7μF
Edc=50V
T.C.=X7S
LxWxT:3.2x2.5x2.3mm
General
AEC-Q200