Multilayer Ceramic Chip Capacitors
CGA6P3X8R1C106K250AD
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Production
Size
| Length(L) |
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| Width(W) |
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| Thickness(T) |
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| Terminal Width(B) |
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| Recommended Land Pattern (PA) |
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| Recommended Land Pattern (PB) |
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| Recommended Land Pattern (PC) |
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Electrical Characteristics
| Capacitance |
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| Rated Voltage |
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Temperature Characteristic
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| Dissipation Factor (Max.) |
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| Insulation Resistance (Min.) |
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Other
| Operating Temp. Range |
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| Soldering Method |
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| AEC-Q200 |
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| Packing |
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| Package Quantity |
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Tech Info
Documents
Technical Support Tools
3rd Party ECAD models
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SnapMagic
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
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Conductive Epoxy
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P3X7S1H106M250AE
Capacitance=10μF
Edc=50V
T.C.=X7S
LxWxT:3.2x2.5x2.5mm
Soft termination
AEC-Q200
SMD / SMT Inductors (Coils)
MLF2012DR82KT000
L=0.82μH
Rated current=150mA
L x W x T :
2 x 1.25 x 1.25mm
Signal Line Common Mode Chokes/Filters
ACT45B-510-2P-TL003
|Z|=2800Ω at 10MHz
Rated current=0.2A
L x W x T :
4.5mm x 3.2mm x 2.8mm
Embedded Motor Controllers
HVC4223F
6 Integrated Half-Bridges
High-Performance 32-Bit ARM®
Cortex®-M3 Core
Chip NTC Thermistors (Sensor)
NTCG104BH102JT1
Resistance (at 25°C)=1kΩ
Resistance Tolerance (at 25°C)=±5%
