Multilayer Ceramic Chip Capacitors
CGA8L2X7R1H155K160KA
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Documents
Technical Support Tools
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C5750X7R2A225M230KA
Capacitance=2.2μF
Edc=100V
T.C.=X7R
LxWxT:5.7x5x2.3mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
CGA8L2X7R1H225K160KA
Capacitance=2.2μF
Edc=50V
T.C.=X7R
LxWxT:4.5x3.2x1.6mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA8N2X7R2A155K230KA
Capacitance=1.5μF
Edc=100V
T.C.=X7R
LxWxT:4.5x3.2x2.3mm
Mid Volt. (100 to 630V)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA9N3X7R1H106K230KB
Capacitance=10μF
Edc=50V
T.C.=X7R
LxWxT:5.7x5x2.3mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA9N3X7R2E105M230KE
Capacitance=1μF
Edc=250V
T.C.=X7R
LxWxT:5.7x5x2.3mm
Soft termination
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA9P3X7R1H226M250KB
Capacitance=22μF
Edc=50V
T.C.=X7R
LxWxT:5.7x5x2.5mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA9Q1C0G3A273J280KC
Capacitance=27nF
Edc=1000V
T.C.=C0G
LxWxT:5.7x5x2.8mm
High Volt. (1000V and over)
AEC-Q200
SMD / SMT Inductors (Coils)
MLP2520HR47MT0S1
L=0.47μH
Rated current=2100mA
L x W x T :
2.5 x 2 x 0.85mm
SMD / SMT Inductors (Coils)
RLF7030T-2R2M5R4
L=2.2μH
Rated current=5.5A
L x W x T :
7.3 x 6.8 x 3.2mm
Chip NTC Thermistors (Sensor)
NTCG163JF103FTDS
Resistance (at 25°C)=10kΩ
Resistance Tolerance (at 25°C)=±1%