Multilayer Ceramic Chip Capacitors
CGB1T3X6S0G104M022BB
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Terminal Spacing(G) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
Temperature Characteristic
|
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
Tech Info
Technical Support Tools
3rd Party ECAD models
-
SnapMagic
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C0510X7R1E473M030BA
Capacitance=47nF
Edc=25V
T.C.=X7R
LxWxT:0.52x1x0.3mm
Low ESL reverse geometry
Multilayer Ceramic Chip Capacitors
C1608X7R1H474M080AE
Capacitance=0.47μF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
Soft termination
Multilayer Ceramic Chip Capacitors
C4532X5R1E156M250KA
Capacitance=15μF
Edc=25V
T.C.=X5R
LxWxT:4.5x3.2x2.5mm
General
Multilayer Ceramic Chip Capacitors
C4532X7T2E684M160KA
Capacitance=0.68μF
Edc=250V
T.C.=X7T
LxWxT:4.5x3.2x1.6mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
C4532X7T2J224M200KE
Capacitance=0.22μF
Edc=630V
T.C.=X7T
LxWxT:4.5x3.2x2mm
Soft termination
Multilayer Ceramic Chip Capacitors
CKG57KX7T2E225M335JJ
Capacitance=2.2μF
Edc=250V
T.C.=X7T
LxWxT:6x5x3.35mm
MEGACAP type
AEC-Q200
MLCC with Dipped Radial Lead
FA26C0G2A223JNU06
Capacitance=22nF
Edc=100V
T.C.=C0G
LxWxT:5.5x6x3.5mm, Lead pitch:5mm
AEC-Q200
General
MLCC with Dipped Radial Lead
FG18X7R1E105KRT06
Capacitance=1μF
Edc=25V
T.C.=X7R
LxWxT:4x5.5x2.5mm, Lead pitch:2.5mm
General
MLCC with Dipped Radial Lead
FG18X7R2A103KNT06
Capacitance=10nF
Edc=100V
T.C.=X7R
LxWxT:4x5.5x2.5mm, Lead pitch:2.5mm
General
Snap-in, Multi Pin, Large Size Capacitors
B43644E5277M060
270µF/450V DC
25mm dia x 45mm length
