Multilayer Ceramic Chip Capacitors

FAQ

CGB1T3X6S0G104M022BB

TDK item description  ?
CGB1T3X6S0G104MT****
Applications
Commercial GradeCommercial Grade
Feature
LowTLow Profile
Series
CGB1(0603) [EIA 0201]
Status
ProductionProduction
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:CGB1
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
0.60mm ±0.03mm
Width(W)
0.30mm ±0.03mm
Thickness(T)
0.19mm ±0.03mm
Terminal Width(B)
0.10mm Min.
Terminal Spacing(G)
0.20mm Min.
Recommended Land Pattern (PA)
0.25mm to 0.35mm
Recommended Land Pattern (PB)
0.20mm to 0.30mm
Recommended Land Pattern (PC)
0.25mm to 0.35mm

Electrical Characteristics

Capacitance
100nF ±20%
Rated Voltage
4VDC
Temperature Characteristic  ?
X6S(±22%)
Dissipation Factor (Max.)
10%
Insulation Resistance (Min.)
1000MΩ

Other

Operating Temp. Range
-55 to 105°C
Soldering Method
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
15000pcs
Collapse All Expand All

Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

Loading... This process may take a while...