Multilayer Ceramic Chip Capacitors
CGB2A1JB0J225M033BC
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Terminal Spacing(G) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
Tech Info
Technical Support Tools
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C0603X7S1C104K030BB
Capacitance=100nF
Edc=16V
T.C.=X7S
LxWxT:0.6x0.3x0.3mm
General
Multilayer Ceramic Chip Capacitors
C5750X7T2E225K250KE
Capacitance=2.2μF
Edc=250V
T.C.=X7T
LxWxT:5.7x5x2.5mm
Soft termination
Multilayer Ceramic Chip Capacitors
CEU4J2X7R1H104K125AE
Capacitance=0.1μF
Edc=50V
T.C.=X7R
LxWxT:2x1.25x1.25mm
Serial design
AEC-Q200
Multilayer Ceramic Chip Capacitors
CEU4J2X7R2A682M125AE
Capacitance=6.8nF
Edc=100V
T.C.=X7R
LxWxT:2x1.25x1.25mm
Serial design
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA1A1X7T0G104M030BC
Capacitance=0.1μF
Edc=4V
T.C.=X7T
LxWxT:0.6x0.3x0.3mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P4NP02W333J250AA
Capacitance=33nF
Edc=450V
T.C.=NP0
LxWxT:3.2x2.5x2.5mm
Mid Volt. (100 to 630V)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGB1T3X5R0J104M022BB
Capacitance=0.1μF
Edc=6.3V
T.C.=X5R
LxWxT:0.6x0.3xmm
Low profile
Multilayer Ceramic Chip Capacitors
CGB2A1JB1A105K033BC
Capacitance=1μF
Edc=10V
T.C.=JB
LxWxT:1x0.5xmm
Low profile
Multilayer Ceramic Chip Capacitors
CGB2A1JB1C474K033BC
Capacitance=0.47μF
Edc=16V
T.C.=JB
LxWxT:1x0.5xmm
Low profile
Multilayer Ceramic Chip Capacitors
CGB2A1JB1C474M033BC
Capacitance=0.47μF
Edc=16V
T.C.=JB
LxWxT:1x0.5xmm
Low profile