Multilayer Ceramic Chip Capacitors
CGB2A1X5R1A105K033BC
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Terminal Spacing(G) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
Tech Info
Technical Support Tools
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C1005C0G1H270J050BA
Capacitance=27pF
Edc=50V
T.C.=C0G
LxWxT:1x0.5x0.5mm
General
Multilayer Ceramic Chip Capacitors
C1608C0G1H270J080AA
Capacitance=27pF
Edc=50V
T.C.=C0G
LxWxT:1.6x0.8x0.8mm
General
Multilayer Ceramic Chip Capacitors
C1608X7R1H104M080AE
Capacitance=0.1μF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
Soft termination
Multilayer Ceramic Chip Capacitors
CGB4B1X5R1E225K055AC
Capacitance=2.2μF
Edc=25V
T.C.=X5R
LxWxT:2x1.25xmm
Low profile
Multilayer Ceramic Chip Capacitors
CGJ5H3C0G2D472J115AA
Capacitance=4.7nF
Edc=200V
T.C.=C0G
LxWxT:3.2x1.6x1.15mm
Mid Volt. (100 to 630V)
High Reliability grade
Multilayer Ceramic Chip Capacitors
CKG32KX7R1E475K335AH
Capacitance=4.7μF
Edc=25V
T.C.=X7R
LxWxT:3.6x2.6x3.35mm
MEGACAP type
MLCC with Dipped Radial Lead
FA28C0G1H152JNU06
Capacitance=1.5nF
Edc=50V
T.C.=C0G
LxWxT:4x5.5x2.5mm, Lead pitch:5mm
AEC-Q200
General
MLCC with Dipped Radial Lead
FG16X7R2A105KNT06
Capacitance=1μF
Edc=100V
T.C.=X7R
LxWxT:5.5x6x3.5mm, Lead pitch:2.5mm
General
MLCC with Dipped Radial Lead
FK11X7R1H105KN006
Capacitance=1μF
Edc=50V
T.C.=X7R
LxWxT:5.5x7x4mm, Lead pitch:2.5mm
General
MLCC with Dipped Radial Lead
FK11X7R1H105KN020
Capacitance=1μF
Edc=50V
T.C.=X7R
LxWxT:5.5x7x4mm, Lead pitch:2.5mm
General