Multilayer Ceramic Chip Capacitors

FAQ

CGB2T1X6S0G105M022BC

TDK item description  ?
CGB2T1X6S0G105MT****
Applications
Commercial GradeCommercial Grade
Feature
LowTLow Profile
Series
CGB2(1005) [EIA 0402]
Status
ProductionProduction
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:CGB2
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
1.00mm ±0.05mm
Width(W)
0.50mm ±0.05mm
Thickness(T)
0.19mm ±0.03mm
Terminal Width(B)
0.10mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.30mm to 0.50mm
Recommended Land Pattern (PB)
0.35mm to 0.45mm
Recommended Land Pattern (PC)
0.40mm to 0.60mm

Electrical Characteristics

Capacitance
1μF ±20%
Rated Voltage
4VDC
Temperature Characteristic  ?
X6S(±22%)
Dissipation Factor (Max.)
10%
Insulation Resistance (Min.)
100MΩ

Other

Operating Temp. Range
-55 to 105°C
Soldering Method
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
10000pcs
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Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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