Multilayer Ceramic Chip Capacitors

FAQ

CGB3B1X6S0G475K055AC

Product Status
Obsolete
Discontinue Issue Date : Nov.22, 2022
Last Purchase Order Date : Sep.30, 2024
Last Shipment Date : Oct.31, 2024
TDK Item Description Please refer to the FAQ about part number
CGB3B1X6S0G475KT****
Applications
Commercial Grade
Feature
LowTLow Profile
Series
CGB3(1608) [EIA 0603]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
Thickness(T)
0.50mm ±0.05mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
4.7μF ±10%
Rated Voltage
4VDC
Temperature Characteristic
X6S(±22%)
Dissipation Factor (Max.)
10%
Insulation Resistance (Min.)
21MΩ

Other

Operating Temp. Range
-55 to 105°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
Catalog

Save Page as PDF

Distributor List

Contact Us

Tech Info

Collapse all Expand all

Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph

This data is for reference only and does not guarantee product characteristics.