Multilayer Ceramic Chip Capacitors

Name: CGB3B3JB1A225M055AB : Detailed Information | Capacitors - Multilayer Ceramic Chip Capacitors | TDK Product Center
Brand: TDK
SKU: CGB3B3JB1A225M055AB

Product Top Page

Catalog

Search by Characteristics

Search by Part Number

Part Number List

Cross Reference

Tech Notes

Technical Support Tools

FAQ

EoL/NRND Info.

CGB3B3JB1A225M055AB

Product Status	Obsolete Discontinue Issue Date : Nov.22, 2022 Last Purchase Order Date : Sep.30, 2024 Last Shipment Date : Oct.31, 2024
TDK Item Description Please refer to the FAQ about part number	CGB3B3JB1A225MT****
Applications	Commercial Grade
Feature	LowTLow Profile
Series	CGB3(1608) [EIA 0603]
Brand	TDK
Environmental Compliance Click to learn more about these icons

MLCC,Multilayer Ceramic Chip Capacitors:CGB3

Images are for reference only and show example products.

Size

Length(L)	1.60mm ±0.10mm
Width(W)	0.80mm ±0.10mm
Thickness(T)	0.50mm ±0.05mm
Terminal Width(B)	0.20mm Min.
Terminal Spacing(G)	0.30mm Min.
Recommended Land Pattern (PA)	0.70mm to 1.00mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)	0.80mm to 1.00mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)	0.60mm to 0.80mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance	2.2μF ±20%
Rated Voltage	10VDC
Temperature Characteristic	JB(±10%)
Dissipation Factor (Max.)	10%
Insulation Resistance (Min.)	45MΩ

Other

Operating Temp. Range	-25 to 85°C
Soldering Method	Wave (Flow) Reflow
AEC-Q200	NO
Packing	Punched (Paper)Taping [180mm Reel]
Package Quantity	4000pcs

Catalog

Save Page as PDF

Distributor List

Tech Info

Collapse all Expand all

Documents

Technical Support Tools

3rd Party ECAD models

SnapMagic

Replacing Electrolytic Capacitor with MLCC, Revised Guide

Traditionally, aluminum electrolytic capacitors and tantalum electrolytic capacitors have been widely used for smoothing and decoupling applications that require large capacitance. W...

MLCC Solutions for Power Supply Circuits (Verification of Optimal Structures for Output Capacitors)

In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require h...