Multilayer Ceramic Chip Capacitors

FAQ

CGB3S3X5R0G106M050AB

TDK item description  ?
CGB3S3X5R0G106MT****
Applications
Commercial GradeCommercial Grade
Feature
LowTLow Profile
Series
CGB3(1608) [EIA 0603]
Status
ObsoleteObsolete
Discontinue Issue Date : Nov.22, 2022
Last Purchase Order Date : Sep.30, 2024
Last Shipment Date : Oct.31, 2024
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:CGB3
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
1.60mm +0.20,-0.10mm
Width(W)
0.80mm +0.20,-0.10mm
Thickness(T)
0.45mm ±0.05mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
10μF ±20%
Rated Voltage
4VDC
Temperature Characteristic  ?
X5R(±15%)
Dissipation Factor (Max.)
10%
Insulation Resistance (Min.)
10MΩ

Other

Operating Temp. Range
-55 to 85°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
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Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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