Multilayer Ceramic Chip Capacitors
CGBDT1X7T0E105M022BC
|
|
Size
Length(L) |
|
Width(W) |
|
Thickness(T) |
|
Terminal Width(B) |
|
Recommended Land Pattern (PA) |
|
Recommended Land Pattern (PB) |
|
Recommended Land Pattern (PC) |
|
Electrical Characteristics
Capacitance |
|
Rated Voltage |
|
Temperature Characteristic |
|
Dissipation Factor (Max.) |
|
Insulation Resistance (Min.) |
|
Other
Operating Temp. Range |
|
Soldering Method |
|
AEC-Q200 |
|
Packing |
|
Package Quantity |
|
Tech Info
Technical Support Tools
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
Loading... This process may take a while...
Customer who viewed this product also viewed

Multilayer Ceramic Chip Capacitors
C1608X7T1A106M080AC
Capacitance=10μF
Edc=10V
T.C.=X7T
LxWxT:1.6x0.8x0.8mm
General

Multilayer Ceramic Chip Capacitors
C3225C0G3B103G250AC
Capacitance=10nF
Edc=1250V
T.C.=C0G
LxWxT:3.2x2.5x2.5mm
High Volt. (1000V and over)

Multilayer Ceramic Chip Capacitors
C3225C0G3B103J250AC
Capacitance=10nF
Edc=1250V
T.C.=C0G
LxWxT:3.2x2.5x2.5mm
High Volt. (1000V and over)

Multilayer Ceramic Chip Capacitors
C3225X7S2A335M200AE
Capacitance=3.3μF
Edc=100V
T.C.=X7S
LxWxT:3.2x2.5x2mm
Soft termination

Multilayer Ceramic Chip Capacitors
C5750C0G2A154J230KA
Capacitance=0.15μF
Edc=100V
T.C.=C0G
LxWxT:5.7x5x2.3mm
Mid Volt. (100 to 630V)

Multilayer Ceramic Chip Capacitors
CAA573X7R1V157M670LJ
Capacitance=150μF
Edc=35V
T.C.=X7R
LxWxT:6.2x7.5x6.7mm
MEGACAP type

Multilayer Ceramic Chip Capacitors
CGB1T3X5R0J104M022BB
Capacitance=0.1μF
Edc=6.3V
T.C.=X5R
LxWxT:0.6x0.3xmm
Low profile

Multilayer Ceramic Chip Capacitors
CGB1T3X6S0G104M022BB
Capacitance=0.1μF
Edc=4V
T.C.=X6S
LxWxT:0.6x0.3xmm
Low profile

Multilayer Ceramic Chip Capacitors
CGB2T1X6S0G105M022BC
Capacitance=1μF
Edc=4V
T.C.=X6S
LxWxT:1x0.5xmm
Low profile

Multilayer Ceramic Chip Capacitors
CGBDT1X5R0G105M022BC
Capacitance=1μF
Edc=4V
T.C.=X5R
LxWxT:0.52x1xmm
Low ESL reverse geometry