Multilayer Ceramic Chip Capacitors
CKG32KX7R2E104M335AH
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Size
Length(L) |
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Width(W) |
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Thickness(T) |
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Metal-Frame Width(E) |
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Recommended Land Pattern (PA) |
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Recommended Land Pattern (PB) |
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Recommended Land Pattern (PC) |
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Electrical Characteristics
Capacitance |
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Rated Voltage |
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Temperature Characteristic |
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Dissipation Factor (Max.) |
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Insulation Resistance (Min.) |
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Other
Operating Temp. Range |
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Soldering Method |
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AEC-Q200 |
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Packing |
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Package Quantity |
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Tech Info
Documents
Technical Support Tools
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
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Capacitance=1.8nF
Edc=50V
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LxWxT:1.6x0.8x0.8mm
General

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Capacitance=0.1μF
Edc=50V
T.C.=X7R
LxWxT:2x1.25x1.25mm
Soft termination

Chip Beads
MMZ1608A222BTD25
|Z|=2200Ω at 100MHz
Rated current=200mA
L x W x T :
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Chip Beads
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|Z|=33Ω at 100MHz
Rated current=1600mA
L x W x T :
0.6mm x 0.3mm x 0.3mm