Chip Beads
KMZ1608DHR500CTDH5
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Recommended Land Pattern (A) |
|
| Recommended Land Pattern (B) |
|
| Recommended Land Pattern (C) |
|
Electrical Characteristics
| Impedance at 100MHz |
|
| Rated Current |
|
| DC Resistance (Max.) |
|
Other
| Operating Temp. Range (Including Self-Temp. Rise) |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| Weight |
|
| FIT (Failure In Time) |
|
Tech Info
Technical Support Tools
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C3225X7R2E104K200AE
Capacitance=0.1μF
Edc=250V
T.C.=X7R
LxWxT:3.2x2.5x2mm
Soft termination
Multilayer Ceramic Chip Capacitors
C5750X7R2E105M230KA
Capacitance=1μF
Edc=250V
T.C.=X7R
LxWxT:5.7x5x2.3mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
CGA3E2X7R1H473K080AD
Capacitance=47nF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
Conductive Epoxy
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA3E2X7R1H473M080AA
Capacitance=47nF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA3E2X7R1H682M080AA
Capacitance=6.8nF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
General
AEC-Q200
Chip Beads
KMZ1608AHR252BTD25
|Z|=2500Ω at 100MHz
Rated current=200mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
KMZ1608BHR102CTD25
|Z|=1000Ω at 100MHz
Rated current=300mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
KMZ1608DHR121CTDH5
|Z|=120Ω at 100MHz
Rated current=400mA
L x W x T :
1.6mm x 0.8mm x 0.6mm
Chip Beads
KMZ1608DHR241CTD25
|Z|=240Ω at 100MHz
Rated current=300mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
KMZ1608RHR102ATD25
|Z|=1000Ω at 100MHz
Rated current=400mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
