Multilayer Ceramic Chip Capacitors
CGA3E2X7R1H473K080AD
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Terminal Spacing(G) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
Tech Info
Documents
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C3225X7R2E104K200AE
Capacitance=0.1μF
Edc=250V
T.C.=X7R
LxWxT:3.2x2.5x2mm
Soft termination
Multilayer Ceramic Chip Capacitors
C3225X7R2E224M200AA
Capacitance=0.22μF
Edc=250V
T.C.=X7R
LxWxT:3.2x2.5x2mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
C5750X7R2E105M230KA
Capacitance=1μF
Edc=250V
T.C.=X7R
LxWxT:5.7x5x2.3mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
C5750X7T2J474M250KE
Capacitance=0.47μF
Edc=630V
T.C.=X7T
LxWxT:5.7x5x2.5mm
Soft termination
Multilayer Ceramic Chip Capacitors
C7563X7R1E476M230LE
Capacitance=47μF
Edc=25V
T.C.=X7R
LxWxT:7.5x6.3xmm
Soft termination
Multilayer Ceramic Chip Capacitors
C7563X7S1H226M230LE
Capacitance=22μF
Edc=50V
T.C.=X7S
LxWxT:7.5x6.3xmm
Soft termination
Multilayer Ceramic Chip Capacitors
CEU3E2X7R1H223K080AE
Capacitance=22nF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
Serial design
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA2B3X7R1E224M050BB
Capacitance=0.22μF
Edc=25V
T.C.=X7R
LxWxT:1x0.5x0.5mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA3E2C0G1H222J080AD
Capacitance=2.2nF
Edc=50V
T.C.=C0G
LxWxT:1.6x0.8x0.8mm
Conductive Epoxy
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA3E2X7R1H473K080AA
Capacitance=47nF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
General
AEC-Q200