Chip Beads
MPZ2012S221AT000
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Recommended Land Pattern (A) |
|
| Recommended Land Pattern (B) |
|
| Recommended Land Pattern (C) |
|
Electrical Characteristics
| Impedance at 100MHz |
|
| Rated Current |
|
| DC Resistance (Max.) |
|
Other
| Operating Temp. Range (Including Self-Temp. Rise) |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| Weight |
|
| FIT (Failure In Time) |
|
Tech Info
Technical Support Tools
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C2012X5R0J685K085AB
Capacitance=6.8μF
Edc=6.3V
T.C.=X5R
LxWxT:2x1.25x0.85mm
General
Multilayer Ceramic Chip Capacitors
C3216X5R1A107M160AC
Capacitance=100μF
Edc=10V
T.C.=X5R
LxWxT:3.2x1.6x1.6mm
General
Multilayer Ceramic Chip Capacitors
C3216X8R1H105K160AB
Capacitance=1μF
Edc=50V
T.C.=X8R
LxWxT:3.2x1.6x1.6mm
High Temp. (Up to 150ºC)
Multilayer Ceramic Chip Capacitors
C3216X8R2A224K160AB
Capacitance=0.22μF
Edc=100V
T.C.=X8R
LxWxT:3.2x1.6x1.6mm
High Temp. (Up to 150ºC)
Multilayer Ceramic Chip Capacitors
CGA1A2X7R1H471K030BA
Capacitance=470pF
Edc=50V
T.C.=X7R
LxWxT:0.6x0.3x0.3mm
General
AEC-Q200
MLCC with Dipped Radial Lead
FA24X7S2A334KRU00
Capacitance=0.33μF
Edc=100V
T.C.=X7S
LxWxT:4.5x5.5x3mm, Lead pitch:5mm
AEC-Q200
General
SMD / SMT Inductors (Coils)
VLS252010ET-1R0N
L=1μH
Rated current=1.9A
L x W x T :
2.5 x 2 x 1mm
SMD / SMT Inductors (Coils)
VLS3012ET-4R7M
L=4.7μH
Rated current=1.3A
L x W x T :
3 x 3 x 1.2mm
Chip Beads
MPZ1608D300BTD25
|Z|=30Ω at 100MHz
Rated current=1.8A
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
MPZ1608S221ATA00
|Z|=220Ω at 100MHz
Rated current=2.2A
L x W x T :
1.6mm x 0.8mm x 0.8mm