TDK, as part of its continued efforts to bring environmentally friendly technical solutions to the market, has recently developed a plating process that enables manufacturing of thick, highly precise copper patterns on thin-film substrates without using typical exposure/etching technologies. The copper deposition can be to one or both sides of the thin-film substrate to reduce the coil’s [antenna’s] DC resistance (DCR). This innovation has been achieved through an electro-plating process that uses a nano-dispersed organic polymer called polypyrrole (PPy), a material solution from Achilles Corporation and is combined with TDK’s internal process technology. TDK’s unique copper plating process employs an "additive” methodology, where copper is plated only on defined areas to form the required pattern and is in direct contrast to standard methods that etch away from a copper layer in a subtractive process. Additionally, by incorporating TDK’s proprietary high-performance magnetic shielding materials, end-product miniaturization can be realized.

TDK Corporation (TSE:6762) announces the release of five new SMD multilayer varistors (MLVs). As an industry first, these components feature a reduced carbon (CO2) footprint while fulfilling demanding automotive qualification requirements. These parts are the first representatives of TDK’s new X-series, which is continually being expanded for automotive as well as for industrial and consumer applications. The X series satisfies both the growing demand for eco-friendly products, and the commercial requirement for cost-attractive products, while maintaining TDK’s high level of reliability and performance.

The PLE Series power inductor is a high-efficiency, low-leakage flux, ultra-compact power inductor that excels during operation with small batteries, such as those used in wearable devices.
Using our original structural design and newly developed materials, the PLE Series achieves a wide range of inductance values through advanced thin-film processes.
This chapter explains the structure and characteristics and provides other useful information including applications.　

TDK Corporation introduces the xEVCap, a standardized and modular DC link capacitor design for powertrain inverters in passenger cars, commercial and off-highway vehicles, and machinery tools. Typically, such capacitor designs are fully customized, making the development time-consuming and practical only in large production volumes. In addition, if the customer requirements change during the project, this can further increase the time required for capacitor development and thus delay the overall project.

In applications like process automation and food and beverage production, data often needs to be transmitted from sensors within closed metallic structures. So, how to get data into and out of these without drilling a hole? Acoustic Data Link is TDK’s answer.

As electronic devices become faster and operate at higher frequencies, capacitors used for noise filtering and decoupling applications require even lower ESL (Equivalent Series Inductance) characteristics.
Additionally, in automotive electrical systems, there is an increasing demand for low-ESL type products to improve safety and comfort and to meet the demands of infotainment.
This Solution Guide introduces various solutions utilizing TDK's advanced low-ESL components, the "YFF Series" 3-terminal feed-through filter.

TDK Corporation (TSE:6762) has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types – one with standard termination (B58043I9563M052) and one with soft termination (B58043E9563M052). As electric vehicles with 800 V battery voltage are becoming more popular, these new components are obvious candidates because their optimal operating point is exactly at this voltage. While the existing 500 V CeraLink series is aimed at 400 V inverters equipped with gallium nitride (GaN) transistors or silicon MOSFETs, the new 900 V parts with a withstanding voltage of more than 1 kV are targeted at 800 V inverters equipped with silicon carbide (SiC) MOSFETs or silicon IGBTs.

For electronic device design, it is important to allow necessary signals to pass while to block unwanted signals (noise). Some pattern designs of a printed circuit board (PCB) can be influenced by ESD (electrostatic discharge). By visualizing the behavior of ESD intruding into the PCB, we can confirm the effectiveness of ESD countermeasures for the PCB design. In this article, we introduce effective GND pattern designs and the use of ESD protection components to enhance ESD robustness.

TDK extends AEC-Q200 qualified SMD alloy powder choke series ERU27M for rated currents up to 48 A. read more!

TDK Corporation announces a series of 10BASE-T1L plug-and-play test boards, called EVB-DLA-00x. The series is available in six different power classes to match the Single Pair Ethernet (SPE) evaluation boards EVAL-ADIN1100EBZ and EVAL-ADIN1110EBZ from Analog Devices.