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The level of cleanliness required for manufacturing processes such as semiconductor facilities and flip chip mounters is ever rising. TDK obtained the particle score which was the world's best ever recorded level in a PWP test. We manufacture and sell the next generation mini-environment systems equipped with the FOUP load port compatible with every company's 300-mm FOUP with no adjustment, enabled by the air cushion system, as well as with an automatic nitrogen purge. In addition, we manufacture and sell flip chip mounting systems which are highly reliable, space saving, and economically priced. TDK, the supplier of electronic components, brings these systems to you after thoroughly evaluating the needs at production sites from the user's perspective.

News

Oct. 17, 2016
18th IC PACKAGING TECHNOLOGY EXPO (held inside NEPCON JAPAN)
Apr. 19, 2016
Application Guides|Added Medical equipment
Oct. 29, 2014
Application Guides|Added 4 categories: Smartphone/Tablet, Automotive (HV/xEV), Car Infotainment, and Wearables
May. 15, 2014
New TDK Product Center established
Jul. 3, 2012
New FOUP Load Port Models Launched