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If the circuit runs hot and there is significant ripple current then one or both factors needs to be reduced. The Design Engineer needs to investigate all options to reduce the circuit temperature. To address the external temperature aspect, this may require something as simple as adding heat sinks and cooling fans. Electrically, the Design Engineer needs to reduce the ripple current. One consideration is to add smoothing circuits to reduce the ripple current level. Another option is to add several MLCCs in parallel to distribute the current.
Specific solutions really depend on the exact circuit as well as use conditions for the module.
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