Multilayer Ceramic Chip Capacitors

FAQ

C1608X8R1H103M080AE

Product Status
Production (NRND)
Recommended Alternate Part No. : C1608X8R1H103K080AE (Interchangeability is not guaranteed.)
TDK Item Description Please refer to the FAQ about part number
C1608X8R1H103MT***S
Applications
Commercial Grade
Please refer to Part No. CGA3E2X8R1H103M080AE for Automotive use.
Feature
150°CHigh Temperature Application
SoftSoft Termination
Series
C1608 [EIA 0603]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
1.60mm +0.20,-0.10mm
Width(W)
0.80mm +0.15,-0.10mm
Thickness(T)
0.80mm +0.15,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
10nF ±20%
Rated Voltage
50VDC
Temperature Characteristic
X8R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
10000MΩ

Other

Operating Temp. Range
-55 to 150°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
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Characteristic Graph

This data is for reference only and does not guarantee product characteristics.