Multilayer Ceramic Chip Capacitors

C2012X5R1C335M085AB

Product Status
Production (NRND)
TDK Item Description Please refer to the FAQ about part number
C2012X5R1C335MT****
Applications
Commercial Grade
Please refer to Part No. CGA4J3X5R1C335M125AB for Automotive use.
Feature
GeneralGeneral (Up to 75V)
Series
C2012 [EIA 0805]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
0.85mm ±0.15mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
3.3μF ±20%
Rated Voltage
16VDC
Temperature Characteristic
X5R(±15%)
Dissipation Factor (Max.)
7.5%
Insulation Resistance (Min.)
30MΩ

Other

Operating Temp. Range
-55 to 85°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs

Tech Info

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3rd Party ECAD models

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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