Multilayer Ceramic Chip Capacitors

FAQ

C2012X6S1H335K125AC

Product Status
Production (NRND)
TDK Item Description Please refer to the FAQ about part number
C2012X6S1H335KT****
Applications
Commercial Grade
Feature
GeneralGeneral (Up to 75V)
Series
C2012 [EIA 0805]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
1.25mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
3.3μF ±10%
Rated Voltage
50VDC
Temperature Characteristic
X6S(±22%)
Dissipation Factor (Max.)
7.5%
Insulation Resistance (Min.)
151MΩ

Other

Operating Temp. Range
-55 to 105°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
FIT (Failure In Time)
This will be displayed when you login to myTDK
Catalog

Distributor Stock Info

Save Page as PDF

Distributor List

Contact Us

Tech Info

Collapse all Expand all

Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph

This data is for reference only and does not guarantee product characteristics.