Multilayer Ceramic Chip Capacitors
C3225X7R1N106K250AC
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Technical Support Tools
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C1005X7R1E224K050BE
Capacitance=0.22μF
Edc=25V
T.C.=X7R
LxWxT:1x0.5x0.5mm
Soft termination
Multilayer Ceramic Chip Capacitors
C2012JB2E152M085AA
Capacitance=1.5nF
Edc=250V
T.C.=JB
LxWxT:2x1.25x0.85mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
C3225C0G3A562G200AC
Capacitance=5.6nF
Edc=1000V
T.C.=C0G
LxWxT:3.2x2.5x2mm
High Volt. (1000V and over)
Multilayer Ceramic Chip Capacitors
C3225C0G3A562J200AC
Capacitance=5.6nF
Edc=1000V
T.C.=C0G
LxWxT:3.2x2.5x2mm
High Volt. (1000V and over)
Multilayer Ceramic Chip Capacitors
C3225X7R1H106K250AC
Capacitance=10μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
General
Multilayer Ceramic Chip Capacitors
C3225X7R1N106M250AC
Capacitance=10μF
Edc=75V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
C3225X7R2A106K250AC
Capacitance=10μF
Edc=100V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
C5750X7R1V476M230KC
Capacitance=47μF
Edc=35V
T.C.=X7R
LxWxT:5.7x5x2.3mm
General
Multilayer Ceramic Chip Capacitors
CGA1A2X7R1C472K030BA
Capacitance=4.7nF
Edc=16V
T.C.=X7R
LxWxT:0.6x0.3x0.3mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA2B3X7R1H223M050BE
Capacitance=22nF
Edc=50V
T.C.=X7R
LxWxT:1x0.5x0.5mm
Soft termination
AEC-Q200