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MLCC Solutions for Data Center (AI Server) Power Systems

In recent years, driven by the expansion of AI and cloud demand, data center servers have become more highly integrated and higher performing, causing a rapid rise in power density per rack/server. This requires PSU (power supply unit) and intermediate bus converters (IBC) to use components with higher efficiency, reliability, and density. In particular, the performance and form factor of passive components such as MLCCs (multi-layer ceramic capacitors) have become key design constraints. In this article, considering these trends, we introduce our lineup of MLCC products for PSUs and IBCs.
data_center_psu_solutions_thumbnail.png
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Power Trends in Data Centers in the AI era

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forecast_of_power_consumption_in_data_centers


Source: JST Low Carbon Society Strategy Cente
"The Impact of the Information Society on Energy Consumption (Vol.4)"
(LCS-FY2021-PP-01). Prepared by TDK."

 

Figure 1. Current and Projected 
Total Power Consumption of Data Centers

With the rapid spread of AI in recent years, server power consumption in data centers has increased dramatically. Accordingly, the importance of high-efficiency, high-power-capacity power supplies (PSUs) to support stable server operation has grown.
Moreover, advances in server cooling methods and higher integration demand strong space savings on PCBs inside server racks. As a result, passive components used in PSUs must be high-performance, compact and low-profile, and reducing PCB footprint is a major challenge.
We offer a lineup of high-voltage, high-performance capacitors and other solutions that contribute to high-efficiency power designs for data centers to meet the needs for higher power and higher density in PSUs.

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Power System Architecture of Data Centers

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In server power systems, a typical power chain is UPS (Uninterruptible Power Supply) → PSU (Vac → 48V etc.) → IBC (48V → 12V etc.) → VRM (conversion to CPU/GPU voltages). At each stage, high efficiency, low emissions, low ripple, heat tolerance, and long-term reliability are strongly required.
In environments with increasing density and output, reducing losses and managing heat at the PSU stage and improving power transmission efficiency at the IBC stage are key design considerations.
In addition to offering MLCCs rated for 100V and 450V and above, we provide MLCC configuration proposal tools and thermal design simulation services to help solve customer challenges. 

power_system_of_the_ data_center
  • UPS: Uninterruptible Power Supply
  • PSU: Power Supply Unit
  • IBC: Intermediate Bus Converter
  • VRM: Voltage Regulator Module
Figure2.Power System Architecture of a Data Center 
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Power-performance Trends of PSUs for Data Centers

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data_center_trend_of_psu


Figure 3. PSU Power Trend (TDK Estimate)

  • Increase in output power: Designs are shifting from the conventional kilowatt-class to 6–12 kW and above. Higher output increases voltage and current stress on components.
  • Evolution of topologies: In both PFC and DCDC stages, there is a trend toward multilevel and parallel architectures to reduce losses and distribute heat.
  • Changes in component requirements: MLCCs demand higher voltage ratings, lower ESR, and higher reliability.
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Changes in Circuit Topology for Increased PSU Power - DC/DC

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LLC resonant converters are the main topology for the PSU DC/DC stage because they achieve low switching losses and high efficiency.
For higher power, phase-parallel (interleaved) designs and series/parallel power block configurations are adopted to distribute current and heat while expanding power capacity.

  • Role of MLCCs: Use high-voltage and low-loss Class 1 C0G MLCCs  for the LLC resonance capacitor circuits.
  • MLCC configuration proposal tool: We provide a tool to propose series/parallel MLCC configurations based on high-voltage Class 1 products and driving conditions.
changes_in_psu_circuit_topology_dcdc
Figure 4. Example Circuit of an LLC Resonant Converter
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Resonant Cap. (Class1)
Mid/ High Voltage Series
010101_c3225-g_pi0801.png
1250VC3225C0G3B103J
(3.2 x 2.5mm/0.01uF)
Detail go_to_detail 
1000VC3225C0G3A223J
(3.2 x 2.5mm/0.022uF)
630VC3225C0G2J333J
(3.2 x 2.5mm/0.033uF) 
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Changes in Circuit Topology for Increased PSU Power - PFC

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For very large power levels, circuit topologies employing flying capacitors are being considered.
Background of flying capacitor adoption: Creating intermediate potentials reduces voltage stress on semiconductors, enabling lower switching losses and lower component ratings. In three-level configurations, the applied voltage across flying capacitors is often ideally half of the DC bus, so MLCCs with 450V ratings are useful.

changes_in_psu_circuit_topology_pfc
Figure 5. Example PFC Circuit
Flying Capacitor
Mid/ High Voltage Series
010101_c5750-b_pi0801.png
450VC5750X6S2W225K (~105℃)
(5.7 x 5.0mm/2.2uF)
Detail go_to_detail 
C5750X7T2W105K (~125℃)
(5.7 x 5.0mm/1.0uF)
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MLCC Lineup for PSU (Vac → 48V)

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Introduction of MLCC products commonly used in typical PSUs. Recommended parts by application are as follows:
Y cap.: For EMI filters, compliant with safety standard Y2 class.
Bypass Cap.: High-voltage MLCCs rated 630V and above; used in parallel with large electrolytic capacitors to reduce ripple.
Snubber cap.: High-voltage Class 1 MLCCs with excellent surge tolerance.   
Resonant cap.: High-voltage Class 1 MLCCs optimized for resonance.   
48V Output Cap.: Large-capacitance MLCC with 100V and 75V ratings to reduce part count.

data_center_circuit_psu
Figure 6. Data Center PSU Circuit Diagram

Featured Products

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R.V. = Rated Voltage

Y Cap.
CS Series (Safety Certified Y2)
Bypass / Snubber Cap. (R.V.630V)
Mid / High Voltage Series.​
Resonant Cap. (Class1)
Mid / High Voltage Series
48V Output Cap. (R.V.75V~100V)
Mid Voltage Series
010102_leaddisk_type-c_pi0801.png
010101_c3225-b_pi0801.png
010101_c3216-b_pi0801.png
010101_c3225-g_pi0801.png
010101_c3225-b_pi0801.png
010101_c3216-b_pi0801.png
Y2 300Vac4.7nF(2.2nF – 10nF)Filtering​
630V​
 
C3225X7T2J154K
(3.2 x 2.5mm/0.15uF)
1250VC3225C0G3B103J
(3.2 x 2.5mm/0.01uF)
100V
 
C3225X7R2A106K​
(3.2 x 2.5mm/10uF)
Detail go_to_detailC3225X7T2J104K
(3.2 x 2.5mm/0.1uF)
1000VC3225C0G3A223J
(3.2 x 2.5mm/0.022uF)
C3216X7R2A475K
(3.2 x 1.6mm/4.7uF)
C3216X7T2J473K​
(3.2 x 1.6mm/0.047uF)
630VC3225C0G2J333J
(3.2 x 2.5mm/0.033uF)
C2012X7R2A225K
(2.0 x 1.25mm/2.2uF)
Detail go_to_detailDetail go_to_detailDetail go_to_detail
Snubber
630V​
220pF to 2.2nF75VC3225X7R1N106K​
(3.2 x 2.5mm/10uF)
Detail go_to_detailDetail go_to_detail

 

 

MLCC Lineup for IBC (48V → 12V, etc.)

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For IBCs (48V → 12V), in addition to traditional LLC circuits, high efficiency and high density across a wide input range are required. One solution is the SCC (Switched Capacitor Converter).

Flying Capacitor : Advantages of Using MLCCs
*High capacitance density: allows large capacitance in a small area.
*Low ESR/low ESL: robust against high-frequency ripple and switching transients, beneficial for suppressing heat generation.
*Large numbers in parallel: distribute current and thermal load per part.

For traditional LLC circuits, we can provide resonant capacitors and input capacitors with 100V ratings, and output capacitors in the 16V–25V rating range, covering the necessary lineup.

data_center_circuit_ibc
Figure 7. Data Center IBC Circuit Diagram

Featured Products

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R.V. = Rated Voltage

Resonant Cap. (Class1)
Mid/ General Voltage Series
Input Cap. ​(R.V.75V~100V)
Mid / General Voltage Series​
Flying Cap. ​(R.V.50V)
General Voltage Series
Output Cap. ​(R.V.16~25V)​
General Voltage Series​
010101_c3225-g_pi0801.png
010101_c3216-g_pi0801.png
010101_c3225-b_pi0801.png
010101_c3216-b_pi0801.png
010101_c3225-g_pi0801.png
010101_c3216-b_pi0801.png
010101_c3225-b_pi0801.png
010101_c3216-b_pi0801.png
100VC3216C0G2A104J
(3.2 x 1.6mm/0.1uF)
100V​
 
C3225X7R2A106K
(3.2 x 2.5mm/10uF)
50VC3225X7R1H106K
(3.2 x 2.5mm/10uF)
25VC3225X7R1E226M​
(3.2 x 2.5mm/22uF)
50VC3216C0G1H104J
(3.2 x 1.6mm/0.1uF)
C3216X7R2A475K
(3.2 x 1.6mm/4.7uF)
C3216X7R1H106K​
(3.2 x 1.6mm/10uF)
C3216X7R1E106K​
(3.2 x 1.6mm/10uF)
C2012C0G1H333J​
(2.0 x 1.25mm/0.033uF)
C3216X6S2A106K​
(3.2 x 1.6mm/10uF)
C2012X7R1H475K​
(2.0 x 1.25mm/4.7uF)
16VC3225X7R1C226M​
(3.2 x 2.5mm/22uF)
Detail go_to_detail75V​C3225X7R1N106K
(3.2 x 2.5mm/10uF)
Detail go_to_detailC3216X7R1C106K​
(3.2 x 1.6mm/10uF)
Detail go_to_detailDetail go_to_detail
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Summary

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This article introduced the latest PSU trends for data center power systems and MLCC product families for PSU/IBC applications. For PSUs moving toward higher efficiency and higher density, choosing the appropriate products such as high-voltage MLCCs and 100V-rated parts for IBC applications is essential. TDK supports improved design quality and reliability for PSU/IBC with a broad MLCC lineup and design support tools including MLCC configuration proposal tools. We will continue to provide solutions that respond to diversifying needs.

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