Multilayer Ceramic Chip Capacitors
C3225X8R1E335K250AE
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
Temperature Characteristic
|
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
Tech Info
Documents
Technical Support Tools
3rd Party ECAD models
-
SnapMagic
Related articles
Show more
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C1608X8R1H102K080AE
Capacitance=1nF
Edc=50V
T.C.=X8R
LxWxT:1.6x0.8x0.8mm
Soft termination
Multilayer Ceramic Chip Capacitors
C2012X7R1E474K125AA
Capacitance=0.47μF
Edc=25V
T.C.=X7R
LxWxT:2x1.25x1.25mm
General
Multilayer Ceramic Chip Capacitors
C2012X7R1E475K125AE
Capacitance=4.7μF
Edc=25V
T.C.=X7R
LxWxT:2x1.25x1.25mm
Soft termination
Multilayer Ceramic Chip Capacitors
C3216C0G2J103J160AE
Capacitance=10nF
Edc=630V
T.C.=C0G
LxWxT:3.2x1.6x1.6mm
Soft termination
Multilayer Ceramic Chip Capacitors
C3225X7R2J473K200AA
Capacitance=47nF
Edc=630V
T.C.=X7R
LxWxT:3.2x2.5x2mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
CGA4J1X7R1E335K125AC
Capacitance=3.3μF
Edc=25V
T.C.=X7R
LxWxT:2x1.25x1.25mm
General
AEC-Q200
SMD / SMT Inductors (Coils)
MLG1005S15NJTD25
L=15nH
Q=8
L x W x T :
1 x 0.5 x 0.5mm
SMD / SMT Inductors (Coils)
MLG1005S27NJTD25
L=27nH
Q=8
L x W x T :
1 x 0.5 x 0.5mm
Chip Beads
MMZ1608D301BTD25
|Z|=300Ω at 100MHz
Rated current=300mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
MMZ1608Y601BTD25
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
