Multilayer Ceramic Chip Capacitors
C3225X8R2A684K250AB
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Size
| Length(L) |
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| Width(W) |
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| Thickness(T) |
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| Terminal Width(B) |
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| Recommended Land Pattern (PA) |
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| Recommended Land Pattern (PB) |
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| Recommended Land Pattern (PC) |
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Electrical Characteristics
| Capacitance |
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| Rated Voltage |
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Temperature Characteristic
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| Dissipation Factor (Max.) |
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| Insulation Resistance (Min.) |
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Other
| Operating Temp. Range |
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| Soldering Method |
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| AEC-Q200 |
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| Packing |
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| Package Quantity |
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| FIT (Failure In Time) |
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Tech Info
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General
Multilayer Ceramic Chip Capacitors
C3225X7R2A105K200AA
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Edc=100V
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Multilayer Ceramic Chip Capacitors
C3225X8R2A684K250AE
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Edc=100V
T.C.=X8R
LxWxT:3.2x2.5x2.5mm
Soft termination
Multilayer Ceramic Chip Capacitors
CGA6P3X8R2A684K250AB
Capacitance=0.68μF
Edc=100V
T.C.=X8R
LxWxT:3.2x2.5x2.5mm
High Temp. (Up to 150ºC)
AEC-Q200
SMD / SMT Inductors (Coils)
TFM252012ALMA3R3MTAA
L=3.3μH
Rated current=2.0A
L x W x T :
2.5 x 2.0 x 1.2mm
SMD / SMT Inductors (Coils)
TFM252012ALVA3R3MTAA
L=3.3μH
Rated current=2.0A
L x W x T :
2.5 x 2.0 x 1.2mm
PTC Limit Temperature Sensors (Sensor)
B59641A0085A062
Sensing Temperature (Nom)=85(°C)
Rated resistance (Nom)=470Ω
Ferrite Cores
HF70RH16x17x9
EMC Suppression(RH)
Dimensions(AxBxC)=16x17x9
