Multilayer Ceramic Chip Capacitors
C3225X8R2A684M250AB
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Technical Support Tools
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C3216X5R1H106K160AB
Capacitance=10μF
Edc=50V
T.C.=X5R
LxWxT:3.2x1.6x1.6mm
General
Multilayer Ceramic Chip Capacitors
C5750X7T2W684K200KA
Capacitance=0.68μF
Edc=450V
T.C.=X7T
LxWxT:5.7x5x2mm
Mid Volt. (100 to 630V)
Multilayer Ceramic Chip Capacitors
CNA6P1X7R2A475K250AE
Capacitance=4.7μF
Edc=100V
T.C.=X7R
LxWxT:3.2x2.5x2.5mm
Soft termination
AEC-Q200