Multilayer Ceramic Chip Capacitors

Name: C5750JB1E226M250KA : Detailed Information | Capacitors - Multilayer Ceramic Chip Capacitors | TDK Product Center
Brand: TDK
SKU: C5750JB1E226M250KA

Product Top Page

Catalog

Search by Characteristics

Search by Part Number

Part Number List

Cross Reference

Tech Notes

Technical Support Tools

FAQ

EoL/NRND Info.

C5750JB1E226M250KA

Product Status	Obsolete Recommended Alternate Part No. : C5750X5R1E226M250KA (Interchangeability is not guaranteed.) Discontinue Issue Date : May.11, 2023 Last Purchase Order Date : Jan.31, 2025 Last Shipment Date : Mar.31, 2025
TDK Item Description Please refer to the FAQ about part number	C5750JB1E226MT****
Applications	Commercial Grade
Feature	GeneralGeneral (Up to 75V)
Series	C5750 [EIA 2220]
Brand	TDK
Environmental Compliance Click to learn more about these icons

MLCC,Multilayer Ceramic Chip Capacitors:C5750

Images are for reference only and show example products.

Size

Length(L)	5.70mm ±0.40mm
Width(W)	5.00mm ±0.40mm
Thickness(T)	2.50mm ±0.30mm
Terminal Width(B)	0.20mm Min.
Recommended Land Pattern (PA)	4.10mm to 4.80mm
Recommended Land Pattern (PB)	1.20mm to 1.40mm
Recommended Land Pattern (PC)	4.00mm to 5.00mm

Electrical Characteristics

Capacitance	22μF ±20%
Rated Voltage	25VDC
Temperature Characteristic	JB(±10%)
Dissipation Factor (Max.)	2.5%
Insulation Resistance (Min.)	22MΩ

Other

Operating Temp. Range	-25 to 85°C
Soldering Method	Reflow
AEC-Q200	NO
Packing	Embossed (Plastic)Taping [180mm Reel]
Package Quantity	500pcs
FIT (Failure In Time)	This will be displayed when you login to myTDK

Catalog

Save Page as PDF

Distributor List

Tech Info

Collapse all Expand all

Documents

Technical Support Tools

3rd Party ECAD models

SnapMagic

Replacing Electrolytic Capacitor with MLCC, Revised Guide

Traditionally, aluminum electrolytic capacitors and tantalum electrolytic capacitors have been widely used for smoothing and decoupling applications that require large capacitance. W...

MLCC Solutions for Power Supply Circuits (Verification of Optimal Structures for Output Capacitors)

In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require h...