Multilayer Ceramic Chip Capacitors

FAQ

C7563X7R1E476M230LE

TDK item description  ?
C7563X7R1E476MT***S
Applications
Commercial GradeCommercial Grade
Please refer to Part No. CGADN3X7R1E476M230LE for Automotive use.
Feature
SoftSoft Termination
Series
C7563 [EIA 3025]
Status
ProductionProduction
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C7563
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
7.50mm ±0.50mm
Width(W)
6.30mm ±0.50mm
Thickness(T)
2.50mm Max.
Terminal Width(B)
0.30mm Min.
Terminal Spacing(G)
Recommended Land Pattern (PA)
5.20mm to 5.80mm
Recommended Land Pattern (PB)
1.70mm to 1.90mm
Recommended Land Pattern (PC)
6.40mm to 7.40mm

Electrical Characteristics

Capacitance
47μF ±20%
Rated Voltage
25VDC
Temperature Characteristic  ?
X7R(±15%)
Dissipation Factor (Max.)
5%
Insulation Resistance (Min.)
10MΩ

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [330mm Reel]
Package Quantity
1000pcs
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Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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