Multilayer Ceramic Chip Capacitors
CGA3E1X7R1V334M080AD
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Size
| Length(L) |
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| Width(W) |
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| Thickness(T) |
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| Terminal Width(B) |
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| Terminal Spacing(G) |
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| Recommended Land Pattern (PA) |
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| Recommended Land Pattern (PB) |
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| Recommended Land Pattern (PC) |
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Electrical Characteristics
| Capacitance |
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| Rated Voltage |
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Temperature Characteristic
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| Dissipation Factor (Max.) |
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| Insulation Resistance (Min.) |
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Other
| Operating Temp. Range |
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| Soldering Method |
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| AEC-Q200 |
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| Packing |
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| Package Quantity |
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Tech Info
Documents
Technical Support Tools
3rd Party ECAD models
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SnapMagic
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
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Multilayer Ceramic Chip Capacitors
C1608X7R1H104K080AA
Capacitance=0.1μF
Edc=50V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
General
Multilayer Ceramic Chip Capacitors
CGA3E1X7R1V105K080AC
Capacitance=1μF
Edc=35V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
General
AEC-Q200
SMD / SMT Inductors (Coils)
VLB7050HT-R15M
L=150nH
Rated current=37A
L x W x T :
6.8 x 6.7 x 4.8mm
SMD / SMT Inductors (Coils)
VLBS1007083T-R15L
L=0.15uH
Rated current=71A
L x W x T :
10.0 x 7.0 x 8.3mm
Chip Beads
MMZ1005A222ETD25
|Z|=2200Ω at 100MHz
|Z|=3000Ω at 1GHz
Rated current=150mA
L x W x T :
1mm x 0.5mm x 0.5mm
