Multilayer Ceramic Chip Capacitors
CGA3E3X5R1A155M080AB
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Size
Length(L) |
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Width(W) |
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Thickness(T) |
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Terminal Width(B) |
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Terminal Spacing(G) |
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Recommended Land Pattern (PA) |
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Recommended Land Pattern (PB) |
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Recommended Land Pattern (PC) |
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Electrical Characteristics
Capacitance |
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Rated Voltage |
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Temperature Characteristic |
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Dissipation Factor (Max.) |
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Insulation Resistance (Min.) |
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Other
Operating Temp. Range |
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Soldering Method |
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AEC-Q200 |
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Packing |
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Package Quantity |
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FIT (Failure In Time) |
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Tech Info
Documents
Technical Support Tools
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C1005X5R1A104K050BA
Capacitance=0.1μF
Edc=10V
T.C.=X5R
LxWxT:1x0.5x0.5mm
General

Multilayer Ceramic Chip Capacitors
C1608X5R0J106K080AB
Capacitance=10μF
Edc=6.3V
T.C.=X5R
LxWxT:1.6x0.8x0.8mm
General

Chip Beads
MMZ1608S601ATD25
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.8mm

Chip Beads
MPZ1005S121ETD25
|Z|=120Ω at 100MHz
|Z|=200Ω at 1GHz
Rated current=1.5A
L x W x T :
1mm x 0.5mm x 0.5mm

Rx Coil Units
WR121210-27M8-ID
Dimensions = Φ12.0mm
Inductance=8.32μH at 100kHz