Multilayer Ceramic Chip Capacitors

FAQ

CGA4J2C0G1H223J125AE

TDK item description  ?
CGA4J2C0G1H223JT***S
Applications
Automotive GradeAutomotive Grade
Feature
AEC-Q200AEC-Q200
SoftSoft Termination
Series
CGA4(2012) [EIA 0805]
Status
ProductionProduction
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C2012
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
2.00mm +0.45,-0.20mm
Width(W)
1.25mm +0.25,-0.20mm
Thickness(T)
1.25mm +0.25,-0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
22nF ±5%
Rated Voltage
50VDC
Temperature Characteristic  ?
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Allowable Voltage
Allowable Current

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
YES
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
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3rd Party ECAD models

  • SnapMagic
    SnapMagic

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Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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