Multilayer Ceramic Chip Capacitors
CGA6P1X8L1H106K250AC
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Documents
Related articles
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C1005JB1H472K050BA
Capacitance=4.7nF
Edc=50V
T.C.=JB
LxWxT:1x0.5x0.5mm
General
Multilayer Ceramic Chip Capacitors
C3225X8L1H106K250AC
Capacitance=10μF
Edc=50V
T.C.=X8L
LxWxT:3.2x2.5x2.5mm
High Temp. (Up to 150ºC)
Multilayer Ceramic Chip Capacitors
CGA3E2NP01H101J080AA
Capacitance=100pF
Edc=50V
T.C.=NP0
LxWxT:1.6x0.8x0.8mm
High Temp. (Up to 150ºC)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA3E2X8R1H473M080AE
Capacitance=47nF
Edc=50V
T.C.=X8R
LxWxT:1.6x0.8x0.8mm
Soft termination
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA5L1X8L0G226M160AC
Capacitance=22μF
Edc=4V
T.C.=X8L
LxWxT:3.2x1.6x1.6mm
High Temp. (Up to 150ºC)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA5L1X8L1C106K160AC
Capacitance=10μF
Edc=16V
T.C.=X8L
LxWxT:3.2x1.6x1.6mm
High Temp. (Up to 150ºC)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA5L1X8L1E106K160AC
Capacitance=10μF
Edc=25V
T.C.=X8L
LxWxT:3.2x1.6x1.6mm
High Temp. (Up to 150ºC)
Multilayer Ceramic Chip Capacitors
CGA5L1X8L1E106K160AE
Capacitance=10μF
Edc=25V
T.C.=X8L
LxWxT:3.2x1.6x1.6mm
Soft termination
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA5L3X8R1H105K160AB
Capacitance=1μF
Edc=50V
T.C.=X8R
LxWxT:3.2x1.6x1.6mm
High Temp. (Up to 150ºC)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA5L3X8R1H105K160AE
Capacitance=1μF
Edc=50V
T.C.=X8R
LxWxT:3.2x1.6x1.6mm
Soft termination
AEC-Q200