Multilayer Ceramic Chip Capacitors

Name: CGB3B1X5R1A475M055AC : Detailed Information | Capacitors - Multilayer Ceramic Chip Capacitors | TDK Product Center
Brand: TDK
SKU: CGB3B1X5R1A475M055AC

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CGB3B1X5R1A475M055AC

Product Status	Obsolete Discontinue Issue Date : Nov.22, 2022 Last Purchase Order Date : Sep.30, 2024 Last Shipment Date : Oct.31, 2024
TDK Item Description Please refer to the FAQ about part number	CGB3B1X5R1A475MT****
Applications	Commercial Grade
Feature	LowTLow Profile
Series	CGB3(1608) [EIA 0603]
Brand	TDK
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MLCC,Multilayer Ceramic Chip Capacitors:CGB3

Images are for reference only and show example products.

Size

Length(L)	1.60mm ±0.10mm
Width(W)	0.80mm ±0.10mm
Thickness(T)	0.50mm ±0.05mm
Terminal Width(B)	0.20mm Min.
Terminal Spacing(G)	0.30mm Min.
Recommended Land Pattern (PA)	0.70mm to 1.00mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)	0.80mm to 1.00mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)	0.60mm to 0.80mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance	4.7μF ±20%
Rated Voltage	10VDC
Temperature Characteristic	X5R(±15%)
Dissipation Factor (Max.)	10%
Insulation Resistance (Min.)	21MΩ

Other

Operating Temp. Range	-55 to 85°C
Soldering Method	Wave (Flow) Reflow
AEC-Q200	NO
Packing	Punched (Paper)Taping [180mm Reel]
Package Quantity	4000pcs

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