TDK offers an extensive lineup of multilayer ceramic chip capacitors with various features to help you solve your problems. Choose a capacitor to best meet your needs.
|Redundant design||Redundant design + low resistance||Low ESL||Conductive
up to 125°C, up to 50V
|Risk reduction by mechanical stress|
|Risk reduction by mechanical stress + low resistance|
|Reduction in the number of MLCCs mounted in series|
|Reduction in the number of decoupling MLCCs|
|High frequency noise removal|
|Conductive epoxy mounting|
For general environment (up to 125°C and 50V), we recommend you to choose a general type.
We recommend you to choose a high temperature/high voltage type, which uses an optimal ceramic to withstand a high temperature and/or high voltage environments.
If you wish to reduce risks related to mechanical stress such as PCB bending, drop impact, thermal shock, and so on, we recommend you to choose a "redundant design type", with which a flexible resin layer or metal frame is implemented in the terminal electrode.
If you wish to reduce the risk by mechanical stress while suppressing rise of electric resistance,
we recommend "redundant design + low resistance" type which is realized by TDK's unique terminal design.
If you wish to reduce the number of MLCCs mounted in series,
we recommend you to choose the serial design type which has 2 capacitor structures in series.
If you wish to reduce the number of MLCCs for decoupling, we recommend you to choose a low ESL type, which has a unique structure for achieving low ESL and low impedance.
If you have difficulty in removing high frequency noise, we recommend you to choose a low ESL type, which has a unique structure for achieving low ESL and low impedance.
For conductive epoxy mounting, we recommend you to choose a special type for conductive epoxy application, which implements the Ag-Pd-Cu alloy terminal electrode that is compatible with conductive glue mounting.