Technical Support Tools

TDK Product Features

TDK's MEMS microphones have achieved compact, low-profile, and high in performance due to the CSMP (chip size MEMS package) technology that has been cultivated through the development of products such as SAW devices.

TDK and InvenSense's analog and digital microphone portfolios build on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. Technological advances like these have enabled machine speech recognition & adaptive noise suppression to become commonplace in consumer devices and other applications.

Humans intuitively understand audio capture to be a critical factor in awareness of their surroundings. Voice capture is quickly becoming the leading interface between man and machine. InvenSense is microphones are first in line to enable smart devices with accurate voice collection. InvenSense combines the capability to sense audio along with a wide sensor portfolio, capturing motion, pressure, air quality and ultrasonic information.


Dec. 3, 2019
The index page for sound application products "Sound Solution" has been released.
Nov. 22, 2019
Application Note "Devices that Enhance the Safety of the Digital Cockpit" has been released.
Jul. 16, 2019
Noise Suppression Filters: Selection Guide has been updated.
Apr. 16, 2019
MEMS Microphones (Microphone): Product Overview "Product Overview MEMS Microphone T4064/T4081" has been updated.
Jan. 11, 2019
Solution Guide"TDMA Noise Countermeasures, Reception Sensitivity Improvement, and ESD (Electrostatic Discharge) Countermeasures in Microphone Lines, Using Noise Suppression Filters and Chip Varistors"has been released.