Multilayer Ceramic Chip Capacitors
CGA8M1X7R3A103M200KA
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Size
Length(L) |
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Width(W) |
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Thickness(T) |
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Terminal Width(B) |
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Recommended Land Pattern (PA) |
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Recommended Land Pattern (PB) |
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Recommended Land Pattern (PC) |
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Recommended Slit Pattern (SD) |
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Electrical Characteristics
Capacitance |
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Rated Voltage |
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Temperature Characteristic |
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Dissipation Factor (Max.) |
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Insulation Resistance (Min.) |
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Other
Operating Temp. Range |
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Soldering Method |
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AEC-Q200 |
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Packing |
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Package Quantity |
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FIT (Failure In Time) |
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Tech Info
Documents
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Specification
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RoHS Certificate
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SVHC / REACH Certificate
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Characterization Sheet
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Selection Guide for Automotive MLCC
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[Promotion Video] xEV Wireless Charger Resonant Circuit Applications
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[Solution Guide] (MLCC C0G Guide for Resonance Circuit Vol.1) Features of High voltage MLCCs with C0G Characteristics and Replacement Solutions
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[Solution Guide] (MLCC C0G Guide for Resonance Circuit Vol.2) Application to EV wireless power transfer systems
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[Solution Guide] (MLCC C0G Guide for Resonance Circuit Vol.3) Application to EV plug-in power charging systems
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Sample Kits
Technical Support Tools
Related articles
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
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