Multilayer Ceramic Chip Capacitors

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TDK Product Features

To make multilayer ceramic chip capacitors more compact with larger capacity, we drew on TDK's advanced material technologies, making the particle sizes super fine. By putting our original processing technologies to full use, we have perfected the advanced layering technique which ensures the precise placing of dielectric and electrode layers, as well as the multilayering technology capable of as many as 1000 layers. The thickness of each layer is at a submicron level. By reducing the thickness of each layer and increasing the number of layers, even the ultrasmall chip combines the capacity close to that of tantalum capacitors with excellent reliability.

News

Mar. 31, 2020
Automotive Application Guides for Safety have been updated.
Mar. 31, 2020
Automotive Application Guide for In-Vehicle Network has been updated.
Mar. 31, 2020
Automotive Application Guides for V2X have been updated.
Mar. 27, 2020
Application Note "Ultrasonic Parking Sensors for Automated Parking" has been released.
Feb. 28, 2020
TDK Virtual Component Library (Keysight PathWave ADS) updated.