Multilayer Ceramic Chip Capacitors

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To make multilayer ceramic chip capacitors more compact with larger capacity, we drew on TDK's advanced material technologies, making the particle sizes super fine. By putting our original processing technologies to full use, we have perfected the advanced layering technique which ensures the precise placing of dielectric and electrode layers, as well as the multilayering technology capable of as many as 1000 layers. The thickness of each layer is at a submicron level. By reducing the thickness of each layer and increasing the number of layers, even the ultrasmall chip combines the capacity close to that of tantalum capacitors with excellent reliability.

News

Dec. 2, 2019
Solution Guide "Soft Termination Capacitors, Inductors, and Chip Beads for High-Reliability Products for Automotive Applications" has been released.
Nov. 2, 2019
TDK Virtual Component Library (S-parameter, Equivalent Circuit Model, SPICE Model) updated.
Aug. 28, 2019
TDK Virtual Component Library (S-parameter, Equivalent Circuit Model, SPICE Model) updated.
Nov. 29, 2018
TDK Virtual Component Library (S-parameter, Equivalent Circuit Model, SPICE Model) updated.
Nov. 29, 2018
"Products Conforming to European Union RoHS Directive / Product Information Concerning Revised China RoHS" has been updated.