TDK offers five series of high-reliability MLCC designed to reduce the risk of short-mode failures caused by board deflection and to improve equipment reliability. In this Guide Vol. 2, we introduce two series equipped with metal frames. Please select the products that best suits your application to help enhance the reliability of your design.

Flex cracks in MLCCs (multilayer ceramic chip capacitors) are caused by PCB warpage or bending. They are a serious reliability risk because they can lower insulation resistance and lead to short-circuit failures. Based on TDK's analysis, this article will explain how the solder land's A and C dimensions and the wiring patterns extending from the MLCC's end side affect stress, for circuit/board design engineers and PCB layout designers.

One of the major reasons of ceramic element cracks in MLCCs (Multilayer Ceramic Chip Capacitors) is due to board flexure stress. The crack may lead to a short circuit failure which can cause abnormal heat generation or ignition, therefore, applications which reliability is important absolutely require suitable countermeasures.
TDK offers five series of high-reliability MLCC products which are designed to reduce the risk of flexure stress related to short circuit in order to improve equipment reliability. Vol.1 of this guide introduces three series using soft termination electrodes. Please select suitable products from these series and use them to improve the reliability of your equipment.

As ADAS/ECU systems grow more sophisticated and xEV voltage levels continue to rise, automotive power circuits must address not only higher capacitance requirements but also countermeasures against cracking caused by board flexure stress and temperature cycling, heat generation, and mounting reliability.
The CA series low-resistance metal-terminal multi-array MLCC Megacap features a structure in which MLCCs are arrayed horizontally in multiple units, combined with optimized metal terminals, meeting the high capacitance, low ESR, and high reliability demands of automotive applications. In addition to automotive-grade products, general-grade products are also available, covering a wide range of applications from automotive equipment to consumer and industrial devices.
This article organizes the key points needed for adoption consideration from the perspectives of CA series structure and application.

In recent years, driven by the expansion of AI and cloud demand, data center servers have become more highly integrated and higher performing, causing a rapid rise in power density per rack/server. This requires PSU (power supply unit) and intermediate bus converters (IBC) to use components with higher efficiency, reliability, and density. In particular, the performance and form factor of passive components such as MLCCs (multi-layer ceramic capacitors) have become key design constraints. In this article, considering these trends, we introduce our lineup of MLCC products for PSUs and IBCs.

Power requirements are increasing in applications such as electric vehicles (EVs) and servers, leading to the growing adoption of Wide Bandgap (WBG) power semiconductors like SiC and GaN. These next-generation power semiconductors are instrumental in downsizing and increasing the efficiency of electronic equipment due to their high-speed switching and low on-resistance. On the other hand, snubber circuits have become increasingly important for protecting switching elements and as EMI countermeasures against overvoltage (surge voltage) and ringing caused by high-speed switching.This application note introduces the utility of Multilayer Ceramic Capacitors (MLCCs) in high-voltage snubber circuits, key considerations for their selection, and TDK's evaluation examples under high dV/dt conditions. We hope this serves as a valuable reference for those considering MLCCs for snubber circuit designs.

Since the advent of large language models (LLMs), artificial intelligence (AI) has been utilized in various scenarios, making AI a familiar presence.
The infrastructure technology supporting this AI utilization is a hardware system capable of advanced and large-scale parallel computation, known as AI accelerators. Currently, many AI accelerators are installed in data centers, but the server/storage/network systems traditionally used in data centers are not designed specifically for the operation of AI accelerators.
Therefore, to install AI accelerators in data centers and provide services that meet the demand for AI, many technical challenges need to be addressed. Among these, cooling of the equipment is considered the most critical issue, and the development of next-generation cooling methods for AI accelerator systems is underway. Among these, immersion cooling systems are said to be the most promising technology due to their significant cooling effects.
This article introduces our company's efforts regarding passive component products for AI accelerator systems using this immersion cooling method.

This guide introduces CNA series – low-resistance soft termination products, which achieves both high reliability and low resistance.

Find the optimal products for you based on the applications and product types.