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- Multilayer Ceramic Chip Capacitors
TDK produces MLCCs with base metal (Ni) inner electrodes and corresponding Cu outer (or terminal) electrodes. This termination is electroplated to protect the component from solder heat leaching and enhance solderability. A Ni barrier plating layer provides solder heat protection and a Pb free Sn overplate (matte finish) provides optimal solderability.
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