FAQ
Q.
No Tin Whisker Risk in TDK MLCCs (2): How does TDK ensure the tin finish will not promote whisker growth?
  • Capacitors
    • >
  • Multilayer Ceramic Chip Capacitors


A. Methyl Sulfonic tin is characterized as a matte finish in the plating industry and contains no organic brighteners. Bright finishes contain organic additives that may encourage tin whisker growth. Furthermore, after electroplating a heat treatment/annealing process (150C / 60min) is employed to relieve any residual plating stress on the component. Small grain size and annealed stress relief is a key point for whisker prevention during component manufacturing.


>>Multilayer Ceramic Chip Capacitors Product site

For any other product-related questions or inquiries, please contact us throughone of our sales representatives or this website.

All related FAQ
Q.
No Tin Whisker Risk in TDK MLCCs (1): What material is used for the internal electrodes and terminal electrodes?
  • Multilayer Ceramic Chip Capacitors
Q.
No Tin Whisker Risk in TDK MLCCs (3): How does TDK test for Sn whisker?
  • Multilayer Ceramic Chip Capacitors