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The solder fillet is most practically expressed in terms of coverage of the component’s height or thickness.
TDK recommends the solder fillet to be 50% of the MLCC thickness. Additionally a thin layer of solder typically extends beyond the fillet’s bulbous volume, indicating the termination was properly “wet” by the solder and therefore exhibits good solderability. EIA*1 recommends >25% of the component thickness.
Note: Often manufactures will try to minimize the amount of solder used for cost control or tombstone prevention, however great care must be used to avoid sacrificing adequate solder fillets and proper terminal adhesion.
Figure 1: Solder fillet*2
*1 ANSI/J-STD-001B, Oct 1996
*2 TDK Multilayer Ceramic Chip Capacitors. Application Manual, Sept 1988 (publication BBE-017A).