Flex Crack Countermeasures (5): What are some common ways that flex cracking occurs?
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A. Any activity that subjects the PCB to significant bending after the MLCCs have been soldered on the board risks cracking.

There are many ways in which a board could experience flexure, both during and after manufacturing.

PCBs frequently undergo a great amount of stress during depaneling. A few additional examples of ways in which a board could bend during the manufacturing process are: attaching connectors and wiring harnesses to connector sockets, sliding the boards into housings (without supporting the board), and screwing down the boards onto screw mounts.

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