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A.
Any activity that subjects the PCB to significant bending after the MLCCs have been soldered on the board risks cracking.
There are many ways in which a board could experience flexure, both during and after manufacturing.
PCBs frequently undergo a great amount of stress during depaneling. A few additional examples of ways in which a board could bend during the manufacturing process are: attaching connectors and wiring harnesses to connector sockets, sliding the boards into housings (without supporting the board), and screwing down the boards onto screw mounts.
>>Multilayer Ceramic Chip Capacitors Product site
>>Flex Crack Countermeasures in MLCCs Outline
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