Traditionally, aluminum electrolytic capacitors and tantalum electrolytic capacitors have been widely used for smoothing and decoupling applications that require large capacitance. With increasing capacitance values, MLCCs are replacing various electrolytic capacitors in power circuits and other applications.
Replacing electrolytic capacitors with MLCCs offers various benefits such as space reduction due to smaller size and lower profile, reduced ripple voltage due to low ESR, and improved reliability due to reduced self-heating.
On the other hand, low ESR, which is an advantage of MLCCs, can sometimes lead to abnormal oscillation or anti-resonance. Additionally, high dielectric constant MLCCs (Class 2) exhibit a characteristic capacitance change when DC voltage is applied, so caution is necessary.
This guide explains the advantages and precautions to be taken when replacing electrolytic capacitors with MLCCs.

NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).

If communication waves from cellular or Wi-Fi sources interfere with and intrude into microphone lines for smartphones or other devices, some of their components will become noise components in audible bands known as "TDMA noise", and may be emitted from speakers as unpleasant sound. Countermeasures which implement combinations of TDK's noise suppression filters and ESD Notch Filters can not only demonstrate outstanding effectiveness at suppressing TDMA noise with no effect on signals, but can also provide a variety of other benefits such as improving cellular or Wi-Fi communication reception sensitivity, and providing countermeasures against ESD (electrostatic discharge).

This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

This article introduces some causes of and effective measures against acoustic noise in power inductors, which are main components in power circuits of devices such as DC-DC converters.

TDK’s chip varistors are ESD protection components that can solve various needs that are specific to audio lines. We shall now explain the various advantages providing the optimal solutions for the audio lines of smartphones.

Ensure voice quality, Prevent degradation of reception sensitivity (self-poisoning), Suppress harmonic distortion in Class-D amplifiers in Noise Suppression Filters for Audio Lines

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).