TDK has developed TCM0403R common mode filters, which have realized a significant size reduction compared to the existing thin-film common mode filters. This size reduction was made possible through the application of unique thin-film processing techniques, developed for HDD heads. These filters are ideal as a noise suppression measure in mobile devices such as smartphones and tablets, for which conservation of space is demanded.

The number of smartphones and other mobile devices that are compatible with NFC (Near Field Communication) is increasing. Thanks to the adoption of a newly-developed low-loss ferrite material, TDK’s MLJ series multilayer ferrite coils now offer improved communication properties which are ideal for NFC-equipped devices, while featuring compact package sizes.

TDK’s CLF-NI-D series wire-wound power inductors are products that benefit from the use of highly heat resistant materials, unique structural designs and methods. The products offer high reliability across a wide range of temperatures from -55°C to +150°C. They are tolerant of the extreme environment found in the engine bay of automobiles, even under the most severe usage conditions.

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).